Thermal Interface Material
Thermal Composite Material
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED back light, Mother Board, Power Supply,Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, NIC, screens, etc.
Property table
| Properties | Ti900 | Unit | Tolerance | Test Method |
| Thermal Conductivity |
1.9 |
W / mK |
±10% |
ASTM D5470 |
| Thickness |
0.12 |
mm |
– |
ASTM D374 |
| Color |
Gray |
– |
– |
Visual |
| Base |
Polyimide |
– |
– |
– |
| Insulation Strength Vac |
6.1 |
KV |
– |
ASTM D149 |
| Volume resistance |
>1012 |
Ohm-m |
– |
ASTM D257 |
| Working temperature |
-50~180 |
°C |
– |
– |
| Tensile Strength |
5000 |
psi |
– |
ASTM D412 |
| Elongation |
40 |
% |
– |
ASTM D412 |
| Flame rating |
V-0 |
– |
– |
UL 94 |
| Standard Shape |
Sheet ones |
– |
– |
– |
| ●Compliance with REACH ●Compliance with RoHS ●Compliance with UL | ||||
|
●Need samples? ●Pre-cut for different shapes |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●Excellent thermal radiation
●Thin & bendable
●Available for unventilated design
●No dusting issue
Metal-based, with a radiant paint coating, can more effectively in product’s heat dissipation.
●With the good flow ability over phase change temperature,surface irregularities can be well filled.
●Low thermal impedance
●With the good flow ability over phase change temperature,surface irregularities can be well filled.
●Low thermal impedance