Tackle High-Heat Challenges – TG-ASD50AB Thermally Conductive Gel Officially Launched

T-Global Technology is proud to introduce the TG-ASD50AB Thermally Conductive Gel, a next-generation high-performance thermal interface material that delivers significant advancements in thermal conductivity, long-term reliability, and application flexibility. Designed to address the thermal demands of high-speed computing, electric vehicles, and industrial electronics, TG-ASD50AB offers a more stable and efficient thermal management solution.

Superior Thermal Performance — Faster, More Reliable Heat Dissipation

TG-ASD50AB features outstanding thermal conductivity of 5.0 W/m·K, ensuring rapid and efficient heat dissipation for high-power components. Its excellent surface conformity and ultra-low thermal resistance dramatically improve heat transfer efficiency, contributing to superior system stability and extended product life cycles.

Proven through rigorous high- and low-temperature cycling and aging tests, TG-ASD50AB demonstrates exceptional long-term durability. With excellent flowability, low stress, and smooth dispensing characteristics, it is compatible with both automated dispensing and manual application processes, providing greater production flexibility.

The product is fully compliant with RoHS and REACH environmental regulations, offering a safe, non-toxic, and sustainable thermal solution aligned with modern green manufacturing standards.

Broad Industry Applications — Tailored for High-Power Systems

TG-ASD50AB is engineered for a wide range of applications, including high-speed servers, 5G base stations, EV power modules, power supplies, and smart devices. It is particularly effective in managing heat for high heat flux density components, meeting the stringent requirements of next-generation thermal management.

Dual Product Options — Flexible Choices for Diverse Thermal Needs

To accommodate different design requirements, T-Global Technology offers two product options:

• TG-ASD35AB: Optimized for cost-effective thermal performance in standard applications.

• TG-ASD50AB: Designed for superior thermal performance in high heat flux environments, providing higher thermal conductivity and lower thermal resistance for mission-critical applications.