What is a heat dissipation module?

Chip Cold Plate Technology: Single-Phase and Two-Phase Liquid Cooling Systems Explained

In high-performance computing environments, chip cold plate technology has become a crucial thermal management solution. Cold plates are typically positioned above heat-generating components like CPUs, GPUs, and memory modules, absorbing and dissipating heat through either single-phase or two-phase liquid cooling systems. Single-phase cold plates use coolant circulated by the CDU (Coolant Distribution Unit) to absorb the heat generated within the server.

Choosing the Right Coolant: Balancing Thermal Conductivity and Viscosity

Selecting the appropriate coolant is vital in a liquid cooling system, requiring a balance between thermal conductivity and viscosity. Water offers the best heat exchange capability, but it is often mixed with glycol to enhance its properties. Although this mixture lowers thermal conductivity, it increases the coolant's viscosity, necessitating higher pump power to maintain the system's circulation.

The Role of Dielectric Coolants

Liquid cooling systems can also utilize dielectric coolants, which help mitigate damage caused by leaks. However, dielectric coolants generally have lower thermal conductivity compared to water-glycol mixtures, making careful selection essential.

 

Author

Professor Wei-Keng Lin

Education | Ph.D., University of Maryland, USA

Current Position | Adjunct Professor, Department of Engineering and Systems Science, National Tsing Hua University

Expertise | Electronic packaging cooling, heat pipes, loop heat pipes (CPL, LHP, PHP), energy-efficient design, solar thermal storage and cooling, thermal flow systems, cooling of electronic components, two-phase flow, thermal components for satellites and high-altitude flying objects