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TG2030 Ultra Soft Thermal Pad
TG2030 Ultra Soft Thermal Pad
TG2030 Ultra Soft Thermal Pad
TG2030 Ultra Soft Thermal Pad
TG2030 Ultra Soft Thermal Pad
TG2030 Ultra Soft Thermal Pad

●Low oil-bleed 

●Ultra soft and high compressibility

●Electrical insulation

●As a buffer in electronics

產品應用

Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat sink, LCD-TV, Notebook, PC, Telecom device, Wireless hub, etc.
DDR ll Module, DVD Applications, Hand-set applications etc.

物性表

Thermal Resistance V.S Pressure V.S Deflection

Pressure (psi) R (℃-in2/W) Deflection (%)
10 0.80  36
30  0.74  55
50  0.69  64

 

 

Properties TG2030 Unit Tolerance Test Method
Thermal Conductivity 

2.1

W / mK

±10%

ASTM D5470

Thickness 

0.5~ 5.0

mm

ASTM D374

0.0197~ 0.1969

inch

ASTM D374

Color 

White 

Visual

Flame Rating 

V-0

UL 94

Dielectric Breakdown Voltage 

16.3

KV / mm

±1.6

ASTM D149

Weight Loss 

<1

%

ASTM E595

Specific Gravity 

2.4

g / cm3

±0.2

ASTM D792

Working Temperature  -45~ +200 °C
Volume Resistance  >1010 Ohm-m ASTM D257
Elongation 

300

%

ASTM D412

Tensile Strength 

1

Kgf / cm2

ASTM D412

Standard Shape 

Sheet ones 

Hardness

30

Shore 00

±10

ASTM D2240

REACH  ●RoHS  ●UL 

●Need Samples?          ●Pre-cut for different shapes

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