TG-NSP25 Non-Silicone Thermal Putty
TG-NSP25 Non-Silicone Thermal Putty
TG-NSP25 Non-Silicone Thermal Putty

TG-NSP25 Non-Silicone Thermal Putty

●Silicone free thermal gel

●Shapeable and compressible

●Low thermal resistance

●No fluidity

●Best for north bridge IC


TG-NSP25 non-silicone thermally conductive paste is a kind of silicone-free thermally conductive paste with 2.6W/m•K thermal conductivity. It has the character of sufficient compressibility and low thermal resistance. It can fill the gaps on the surface of the heat source with a small amount of mortar to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and has the characteristics of non-overflow and non-hardening.

Application

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

TG-NSP25 This product is a silicone-free thermal conductive paste and the color of this product is grey. The advantage of this product is that there is no thermal gel containing silicone oil. It can be shaped and pressed arbitrarily, and Low thermal resistance, working temperature can reach up to 150 degrees high temperature, its material is motor body, without the trouble of liquid flow phenomenon, it is very suitable for the material applied on the IC north bridge.

Property table

Properties Unit TG-NSP25 Tolerance Test Method
Thermal Conductivity 

W/m•K

2.6

±10%

ASTM D5470 Modified

Color

Gray 

Viscosity 0.5rpm 

Pa·s

5000

Brookfield

Density 

g / cm3

2.6

ASTM D792

Low MW Siloxane (D3-10) 

ppm

0

GC/MS

Volume Resistivity 

Ohm-m

1014

ASTM D257

Operating Temperature 

°C

-50~+150

Standard Package

Tube/Pot

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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

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