TG-AS606B / S606B Thermal Grease
●Good thermal conductivity
●Easy to assemble
●High stability
S606B is a thermal paste with 1.9W/m•K thermal conductivity. The fluidity of this product is quite good. It can also fill up the very low thermal resistance of the contact interface itself segregated. Since this is a cost-competitive thermally conductive material, if such high thermal conductivity is not required and there is only a low budget for cost considerations, this type of product is highly recommended.
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
S606B has very good fluidity and can be used to fill up the very low thermal resistance of the contact interface, effectively reducing the heat group, and also exerting the effect of heat conduction. Compared with the trend that the design space of electronic products is getting smaller and smaller today, it is highly recommended for products that do not require too high thermal conductivity and are subject to a considerable range of space. This product is suitable for all kinds of electronic products that require heat dissipation, such as ICs. This type of product can be constructed by syringe or screen printing.
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| Find a high-purity solvent and cloth. |
Wipe the surface of the CPU and the entire heat sink assembly. |
Use the center-point application method |
spread the thermal paste evenly |
Put the cover back on the heat sink |
| T-Global Thermal Paste | |
|---|---|
| *Non-Silicone | - |
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TG-N909 is suitable for optical instruments |
TG-S808 is widely used in the design |
| Thermal Conductivity：9 W/m•K | Thermal Conductivity：8 W/m•K |
| Density：2.85 g/cm3 | Density：2.9 g/cm3 |
| Working Temperature：-40~+200 °C | Working Temperature：-40~+200 °C |
| Volume Resistance：>1013 Ohm-m | Volume Resistance：>1013 Ohm-m |
Property table
| Properties | Unit | TG-AS606B / S606B | Tolerance | Test Method |
| Thermal Conductivity |
W/m•K |
1.9 |
±10% |
ASTM D5470 Modified |
| Color |
– |
White |
– |
– |
| Oil Dispersible |
% |
<0.2 |
– |
24hr @150°C |
| Weight Loss |
% |
<0.5 |
– |
ASTM E595 Modified |
| Density |
g/cm3 |
2.2 |
±5% |
ASTM D792 |
| Operating Temperature |
°C |
-40~+180 |
– |
– |
| Viscosity |
Pa·s |
200(±80) |
– |
Brookfield |
| Volume Resistivity |
Ohm- m |
>1011 |
– |
ASTM D257 |
| Standard Package |
– |
Tube/Pot |
– |
– |
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●Compliance with REACH ●Compliance with RoHS ●Thermal paste has a shelf-life of 12 months fr om the date of manufacture, as indicated by the lot number, when stored in the original, unopened ●If an oil layer occurs on top of the thermal paste, it belongs to a normal phenomenon. We suggest to stir it evenly before usage. |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
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●Good thermal conductivity
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●Easy to assemble
-
●High stability
S606C is a thermal paste with 5.3W/m•K thermal conductivity this paste also known as the thermal paste is mainly used to assist heat sinks, commonly used computer IC wafers to dissipate heat, etc., because it can be used to apply only a thin layer, it can reach 1mm in the thinnest case, the maximum extent Reduce the thickness of the thermal interface material, so the thermal resistance can be minimized.
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●High thermal conductivity
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●Good leveling & no overflow
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●Effectively fill up uneven surfaces
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●Low thermal resistance/low thermal resistance
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●Organic silicon base material has no environmental pollution
TG-AS808 is a thermal paste with 8 W/m•K thermal conductivity it has accumulated years of experience in the research and development of materials for T-Global. In the year 2019, it has launched as a conductive paste, which is also the highest coefficient of thermally conductive paste in the industry. It has good leveling and can effectively fill the unevenness of the metal contact surface. Improve thermal efficiency. Usually used for high-wattage wafers.
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●High thermal conductivity
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●Silicone oil free
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●No overflow
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●Low thermal impedance/thermal resistance
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●Non-silicone base, no Environmental pollution
TG-N909 is a non-silicon thermal conductive paste launched by T-Global in 2019. It is with 9W/m•K thermal conductivity also it’s high-performance thermal conductive material without siloxane. There will be no evaporation of silicone resin and no precipitation of silicone oil. The low thermal resistance of non-silicon thermal paste can absorb high-wattage chip heat, thereby improving the efficiency and service life of heating electronic components.