T-Global has one of the most comprehensive and advanced R&D departments at its headquarters, offering highly tailor-made designs for a wide range of customers. The rapid development of technology has led to a rapid increase in the power of electronic components. Heat dissipation problems need to be addressed effectively to ensure the proper functioning of electronic equipment.
Based on the market trend, we have developed our latest product "TG-AH25 thermal pad." However, most of the high wattage thermal pads in the thermal conductivity field are in the range of 12 to 15W/mK, but after continuous testing and development, we have finally designed a thermal pad with a high thermal conductivity of 25W/mK, which can reduce the thermal contact resistance between the heat source surface and the heat sink, transfer the heat out to the outer casing and minimize the damage rate of the electronic components.