Thermal Interface Material

Thermal Tape

Li98P Thermal Tape
Li98P Thermal Tape
Li98P Thermal Tape
Li98P Thermal Tape
Li98P Thermal Tape
Li98P Thermal Tape

●Great thermal conductivity 

●Good adhesion (Acrylic PSA)

●Great reliability 

●Easy to assemble 

●Customization services for different industries


It has high thermal conductivity, viscosity and low thermal resistance. It is a good replacement for thermal grease as the high viscosity can fix the electronic parts, which is also a great material for fill up the uneven surface between the heat source and heat sink , to transfer the heat to the heat sink finally achieve heat dissipation and lower the product’s temperature.

Application

Electronic components: IC, CPU, MOS,LED,
Mother Board, Power Supply, Heat Sink, LCD-TV,
Notebook , PC, Telecom Device, Wireless Hub.
DDR ll Module, DVD Applications, Hand-set Applications etc.

Property table

Properties Liv2 Li-98P Unit Tolerance Test Method
Thermal Conductivity 1.1 1.1

1.8

1.8

W / mK

±0.17

ASTM D5470

Thickness 0.15 0.25

0.125

0.14

mm

ASTM D374

Color

White

Visual

Reinforcement Carrier Fiberglass Mesh

Polyimide

Continuous Working Temperature -30~120 -30~120

-30~120

-30~120

°C

Short time Use Temperature(30sec) 180 180

250

250

°C

Density 1.85 1.85

1.3

1.2

g / cm3

ASTM D792

Tensile Strength 200 400

500

600

psi

ASTM D412

Glass Transition Temperature -30 -30

-25

-25

°C

Initial Tack 11 10

15

15

cm

PSTC-6

Lap Shear Strength 60 60

63

62

N / cm2

ASTM D1002

Die Shear Strength @25°C 120 120

115

115

N / cm2

Die Shear Strength@80°C 69 69

66

64

N / cm2

Holding Power 1000g @25°C using 1 in2 >10000 >10000

>10000

>10000

min

PSTC-7

Holding Power 1000g @80°C using 1 in2 >10000 >10000

>10000

>10000

min

PSTC-7

90° Peeling Strength (aluminim) 15 16

>10

>10

N / in

ASTM D3330

Dielectric Breakdown Voltage (Vac) 2.1 3.1

4.1

5.1

KV

±10%

ASTM D149

Dielectric Breakdown Voltage (Vdc) 3.1 4.1

5.1

6.1

KV

±10%

ASTM D149

Thermal Impedance @10psi  0.76 1.26

0.78

0.87

°C-in/ W

ASTM D5470

Thermal Impedance @30psi  0.70 1.12

0.75

0.81

°C-in/ W

ASTM D5470

Thermal Impedance @50psi 0.63 1.07

0.73

0.79

°C-in/ W

ASTM D5470

Flame Rating  V-0 V-0

V-0

V-0

UL 94

●Compliance with REACH  ●Compliance with RoHS  ●Compliance with UL

●Need samples?

●Pre-cut for different shapes

●Roll type is  available

●T-global guarantees a 6-month shelf life at maximum continuous storage temperature of 25 ℃ for maintenance of controlled adhesion to the liner.

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

Li2000A Thermal Tape

●Silicone PSA  

●Good adhesive

●Long time use temperature of 170°C  

●UL compliant 

●Electrical insulation


It has high thermal conductivity, viscosity and low thermal resistance. It is a good replacement for thermal grease as the high viscosity can fix the electronic parts, which is also a great material for fill up the uneven surface between the heat source and heat sink , to transfer the heat to the heat sink finally achieve heat dissipation and lower the product’s temperature.

Submit
Li2000 Thermal Tape

●Silicone PSA  

●Good adhesive

●Long time use temperature of 170°C  

●UL compliant 

●Electrical insulation


It has high thermal conductivity, viscosity and low thermal resistance. It is a good replacement for thermal grease as the high viscosity can fix the electronic parts, which is also a great material for fill up the uneven surface between the heat source and heat sink , to transfer the heat to the heat sink finally achieve heat dissipation and lower the product’s temperature.

Submit
Li98 Thermal Tape

●Good adhesion (Acrylic PSA) 

●Great reliability 

●Cost effective with great performance 

●Easy to assemble 

●Customization services for different industries


It has high thermal conductivity, viscosity and low thermal resistance. It is a good replacement for thermal grease as the high viscosity can fix the electronic parts, which is also a great material for fill up the uneven surface between the heat source and heat sink , to transfer the heat to the heat sink finally achieve heat dissipation and lower the product’s temperature.

Submit
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