How to choose the correct thermal material?



Method of choose thermal pad: first select the thermal conductivity and
then select the hardness.

Thermal Conductivity Hardness Thermal Pad Product from T-Global
K=1.4~2.0 Shore 00 25~55 L37-5S, TG2030, L37-3, L37-3S
Shore A 15~25 L37-3L, L37-5
Shore 00 60~65 PC93
Shore A 75~90 GT15/GT20, L37-3F, H48-6S
K=2.1~3.0 Shore A 25~35 H48-2
Shore A 75~90 H48-2K
K=3.1~4.0 Shore 00 25~55 TG4040, TG4040LC
Shore 00 60~65 PC94
Shore A 25~35 H48-6
Shore A 75~90 GT30
K=6 Shore 00 60~65 TG6050
Shore A 25~35 H48-6G
K=12 Shore 00 60~65 TGX


Method of choose thermal tape: first select the thermal conductivity and then select no substrate and then select raw materials.

Thermal Conductivity

No Substrate or Raw Materials

Raw Materials

Thermal Tape Product from T-Global

K=<1 Fiberglass Acrylic PSA Li98, Liv2
K=1.1~1.5 Fiberglass Silicone PSA Li2000
K=1.6~2 Fiberglass Acrylic PSA Li-98C
Polyimide Acrylic PSA Li-98P
無基材 Acrylic PSA Li-98CN 
Silicone PSA Li-2000A 


Method of choose epoxy potting compound: select the thermal conductivity .

Thermal Conductivity

Potting Compound Product from T-Global

K=0.8 S720AB
K=2 S730
K=2.5 A96AB
Thermal management of LED module.
What is thermal interface materials?
What is thermal compound?
Thermal rate and thermal conductivity.
The difference of thermal grease and thermal pad.
The feature and application of thermal tape.
Product properties of thermal conductive.
How to properly apply the thermal paste to the CPU and GPU?
The application and category of TIM(Thermal Interface Materi
The meaning of compressibility relative to TIM.
The meaning of hardness relative to TIM.
What is silicon or non-silicon thermal pad?