Thermal Interface Material

Thermal Pad

TGX Ultra Soft Thermal Pad
TGX Ultra Soft Thermal Pad
TGX Ultra Soft Thermal Pad
TGX Ultra Soft Thermal Pad
TGX Ultra Soft Thermal Pad

●High-end product with thermal conductivity of 12 W / mK

●High compressibility

●Low hardness (Shore 00 65)

●Electrical insulation

Application

Usually used for industrial computers, military products
Electronic components: IC, CPU, MOS, LED, Mother Board,
Power Supply, Heat Sink, LCD-TV , Notebook,PC,
Telecom Device,Wireless Hub etc.
 

Property table

Properties TGX Unit Tolerance Test Method
Thermal Conductivity 

12.6

W / mK

±10%

ASTM D5470

Thickness 

0.5~ 2.0

mm

ASTM D374

0.0197~ 0.0787

inch

ASTM D374

Color 

Gray 

Visual

Flame Rating 

V-0

UL 94

Dielectric Breakdown Voltage 

12.2

KV / mm

±1.2

ASTM D149

Weight Loss 

<1

%

ASTM E595

Specific Gravity 

3.4

g / cm3

±0.2

ASTM D792

Working Temperature 

-45~ +200

°C

Volume Resistance 

>1010

Ohm-m

ASTM D257

Standard Shape 

Sheet ones

Hardness 

55

Shore 00

±10

ASTM D2240

●REACH ●RoHS ●UL
● Need samples?●Pre-cut for different shapes

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