Thermal Interface Material

Thermal Pad

TGX / TG-A126X Ultra Soft Thermal Pad
TGX / TG-A126X Ultra Soft Thermal Pad
TGX / TG-A126X Ultra Soft Thermal Pad
TGX / TG-A126X Ultra Soft Thermal Pad
TGX / TG-A126X Ultra Soft Thermal Pad

●High-end product with thermal conductivity of 12 W / mK

●High compressibility

●Low hardness (Shore 00 65)

●Electrical insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Application

Usually used for industrial computers, military products

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.

Property table

This  is the old series thermal pads, please contact our product consultant if you got any inquiry.

The new  TG-A series thermal pad has better performance on the thermal conductivity,  compressibility, with the ultra-soft softness, low thermal resistance and naturally tacky’s characteristics. It is often used as an interface material for IC and electronic heat dissipation, and is equipped with a heat pipe, vapor chamber and cooling modules.

Recommended ultra soft thermal pad Series

TG-A1250(12.5W/mk)

TG-A1450(14.5W/mk)

TG-A1660(16.6W/mk)

TG-A1780(17.8W/mk)

 

 

Related materials Recommended

TG-A1250 Ultra Soft Thermal Pad

●High thermal conductivity up to 12.5 W/mK

●Low thermal resistance

●High compressibility and compliancy

●Electrical insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A1450 Ultra Soft Thermal Pad

●High thermal conductivity

●Low thermal impedance

●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A1660 Ultra Soft Thermal Pad

●High thermal conductivity

●Low thermal impedance

●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
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