Thermal Interface Material

Thermal Pad

TGX / TG-A126X Ultra Soft Thermal Pad
TGX / TG-A126X Ultra Soft Thermal Pad
TGX / TG-A126X Ultra Soft Thermal Pad
TGX / TG-A126X Ultra Soft Thermal Pad
TGX / TG-A126X Ultra Soft Thermal Pad

●High-end product with thermal conductivity of 12 W / mK

●High compressibility

●Low hardness (Shore 00 65)

●Electrical insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Application

Usually used for industrial computers, military products

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.

Property table

This  is the old series thermal pads, please contact our product consultant if you got any inquiry.

The new  TG-A series thermal pad has better performance on the thermal conductivity,  compressibility, with the ultra-soft softness, low thermal resistance and naturally tacky’s characteristics. It is often used as an interface material for IC and electronic heat dissipation, and is equipped with a heat pipe, vapor chamber and cooling modules.

Recommended ultra soft thermal pad Series

TG-A1250(12.5W/mk)

TG-A1450(14.5W/mk)

TG-A1660(16.6W/mk)

TG-A1780(17.8W/mk)

 

 

Related materials Recommended

TG-A1250 Ultra Soft Thermal Pad

●High thermal conductivity up to 12.5 W/mK

●Low thermal resistance

●High compressibility and compliancy

●Electrical insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1250 is an entry-level high thermal conductivity silicon film with 12.5W/MK. Since 2019, it has been widely used in various electronic products, among which unmanned transportation vehicles, edge computing, industrial control hosts, servers, and other industries are the most.

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TG-A1450 Ultra Soft Thermal Pad

●High thermal conductivity

●Low thermal impedance

●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1450 is an ultra-soft thermal pad that has a high conductivity of 14.5W/MK, and it has excellent characteristics of low thermal resistance. It also has good protection under the condition of high thermal conductivity. The hardness reaches 60 (Shore 00), and it is not easy to warp or twist. It can be cut into pieces according to requirements or punched according to the drawing surface. It has good workability and increases the utilization rate of the production line. The thickness is available from 0.5mm to 2.0mm, with good market price and performance.

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TG-A1660 Ultra Soft Thermal Pad

●High thermal conductivity

●Low thermal impedance

●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1660 thermal pad has a high thermal conductivity 16.6W/MK, the flexible characteristics of soft materials can be attached to uneven surfaces, which fully conducts the heat source to the metal shell or diffuser plate to improve the efficiency and service life of the heating electronic components. 

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