All items


More Innovation, 
Less Heat.
Provides the best solution for our customer and
integrate full range of thermal engineering products.

Selection Guide

Which Products Will Best Fit Your Needs?



  • Thermoelectric Cooling Chip



  • Heat Pipe
  • Vapor Chamber
  • Thermal Interface Material



  • Heat Sink
  • Fan


Magnetic Interference

  • Flexible Absorbent Material

We Integrate Them for You Once
Heat Dissipation Module
The heat dissipation module is mainly composed of two
parts: heat conduction and heat dissipation. None is 
dispensable. It can smoothly conduct heat to a specific
area, and then dissipate the heat through the heat sink.
Thermal Simulation

●Reducing R&D costs
●Save R&D time
●Technology Cooperation Trends

Vapor Chamber

●Quickly cool down 
●3D heat transfer structure
●Flexible accessory combination

The vapor chamber, sometimes called a flat heat pipe or a uniform temperature radiator, adopts the high heat transfer capacity of two-phase cooling in a flat format. For the cooling applications of electronic products, thermal energy transfer is usually carried out on a radiator very close to the heat source; making the vapor chamber assembly an ideal assembly when spreading high heat density or heat load on a larger surface. By using a vapor chamber, you can expect increased heat spread and more uniformity, which is ideal for optimizing the performance of the heat sink.
Like the heat pipe, the vapor chamber is a very reliable heat conduction device. Because they do not have any movable parts or use any corrosive materials.
The use of vapor chamber has increased significantly, because the total power and the power density have risen sharply as a result of shrinking the chip size. In terms of price and application flexibility, today's vapor chamber are more capable and cost less than they were ten years ago.

Heat Pipe

●Quickly solve single point heating
●Large heat transfer, highly efficient
●Small size and weight, High flexibility

Thermal Interface Material

●Diverse product selection

●High customization flexibility

●Effectively reduce thermal resistance 


All heat dissipation starts from heat conduction.
When electronic products are introduced and new, according to the process capability of the production side and the market demand: IC process and chip performance, the wattage has been greatly increased, and the user experience must be considered thin, thin, short and high efficiency, resulting in high unit density on the surface of the heating element. Heat, through the thermal conduction, the continuously generated heat energy is continuously transferred to the heat sink, and finally the thermal balance is achieved when the mechanical components of the product are not overloaded.
Since the contact of different components between products will produce contact surfaces, when heat is conducted, there will be so-called interface thermal resistance that needs to be considered, and the surface of different component materials will have unevenness that cannot be seen by the naked eye, which greatly reduces the two The contact area when the surfaces are in contact must be relied on at this time: the thermal interface material TIM (Thermal Interface Material) fills the micro-voids and uneven pores on the surface when the two materials are joined or contacted, reducing the resistance of heat transfer.
The selection of thermal interface materials with different characteristics can select the most suitable thermal resistance characteristics, heat flux, compressibility, hardness, etc. for different product designs. This is the key point that must be considered at the initial stage of product design.

Heat Sink

●Efficiency improvement for module

●Good choice for heat dissipation 

●Small Quantity Available

Thermoelectric Cooling Chip

●Control temperature easily

●Small size, Light weight

●High reliability

Flexible Absorbent Material

●Ultra-thin and flexible

●Effectively suppress interference

●Excellent performance


●Forced convection preferred 

●Small Quantity Available

●Customized cooling module