TG-A4500 Ultra Soft Thermal Pad
-
●Very good thermal conductivity
-
●High compressibility and compliancy
-
●Natural tack
●Very good thermal conductivity
●High compressibility and compliancy
●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Application
The application industry widely includes medium and high wattage electronic products such as electric vehicles, panels, displays, etc., and have good thermal conductivity
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Tearing off the release paper. |
Gently attach the thermally conductive silicon pad to the heat source. |
Remove the protective film |
Apply components onto the exposed part and apply pressure at fixture. |
TG-A20KX | TG-A2200 | TG-A3500 | TG-A38KX | TG-A4500 | |
---|---|---|---|---|---|
Thermal Conductivity | 2.0 | 2.2 | 3.5 | 3.8 | 4.5 |
Dielectric Breakdown | ≥12 | ≥13 | ≥13 | ≥10 | ≥10 |
Hardness (Shore OO) | 55 | 15 | 35 | 60 | 50 |
TG-A6200 | TG-A1250 | TG-A1450 | TG-A1660 | TG-A1780 | |
---|---|---|---|---|---|
Thermal Conductivity | 6.2 | 12.5 | 14.5 | 16.6 | 17.8 |
Dielectric Breakdown | ≥10 | ≥10 | ≥8 | ≥7 | ≥8 |
Hardness (Shore OO) | 50 | 55 | 55 | 65 | 70 |
Thermal Conductivity Thermal conductivity refers to the ability of a given material to conduct/transfer heat. |
||
Dielectric Breakdown Voltage Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress. |
||
Hardness Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials. |
Property table
Properties | Unit | TG-A4500 | Tolerance | Test Method |
Thermal Conductivity |
W/m•K |
4.5 |
±10% |
ASTM D5470 Modified |
Thickness |
mm |
0.5~8.0 |
– |
ASTM D374 |
inch |
0.0197~0.3149 |
– |
ASTM D374 |
|
Color |
– |
Purple |
– |
Colorimeter CIE 1976 |
Flame Rating |
– |
V-0 |
– |
UL 94 |
Dielectric Breakdown Voltage |
KV / mm |
≥10 |
- |
ASTM D149 |
Weight Loss |
% |
<1 |
– |
ASTM E595 Modified |
Density |
g / cm3 |
3.1 |
±5% |
ASTM D792 |
Operating Temperature | °C | -50 ~ +180 | – | – |
Volume Resistivity | Ohm-m | 1x1013 | – | ASTM D257 |
Elongation |
% |
50 |
– |
ASTM D412 |
Standard Format |
– |
Sheet |
– |
– |
Hardness |
Shore OO |
50 |
±15 |
ASTM D2240 |
●Compliance with REACH ●Compliance with RoHS |
||||
●For thicknesses less than 1.0mm, hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during production |
(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
-
●High thermal conductivity
-
●High compressibility and compliancy
-
●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A6200 thermal pad with 6.2W/m•K and it can perfectly attach to the heat source. With good thermal conductivity, high compressibility, self-adhesion and insulation.
-
●Very good thermal conductivity
-
●High compressibility and compliancy
-
●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
-
●One side is non-sticky and easy to assemble
-
●Ultra soft and good compressibility
-
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.