TG-A730AB / S730AB Potting Compound
●Good thermal conductivity
●Heat curing
●Can be applied with pistol
●Low viscosity
●Easy to assemble
S730 is a silicone potting compound with 2.1W/m•K thermal conductivity and the mixing ratio is 1:1 which is easy to mix, can be matched with an extrusion gun for easy operation and easy construction, S730 thermally conductive sealant also has high stability, low viscosity, and quick-drying And other excellent characteristics.
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
S730 thermally conductive sealant is suitable for electronic components. After heating and curing, it has high hardness and can be used for support. After curing, it can protect the mechanism and prevent it from being affected by the external environment.
Property table
| Properties | Unit | TG-A730 / S730 | Tolerance | Test Method |
| Thermal Conductivity |
W/m•K |
2.1 |
±10% |
ASTM D5470 Modified |
| Color |
– |
Gray |
– |
– |
| Dielectric Breakdown Voltage |
KV/mm |
≥11 |
– |
ASTM D149 |
| Volume Resistivity |
Ohm-m |
1*1012 |
– |
ASTM D257 |
| Density |
g / cm3 |
2.3 |
±5% |
ASTM D792 |
| Operating Temperature |
°C |
-50~+200 |
– |
– |
| Viscosity |
Pa·s |
6~12 |
– |
Brookfield |
| Curing Time @25° C | Min | 180 | – | – |
| Curing Time @60° C | Min | 15 | – | – |
| Curing Time @100° C | Min | 5 | – | – |
| Standard package |
– |
Tube/Pot |
– |
– |
| Hardness |
Shore A |
60 |
±10 |
ASTM D2240 |
| Mixing ratio | gram | 1:1 | – | – |
| ●Compliance with REACH ●Compliance with RoHS | ||||
| ●Need samples? | ||||
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●Epoxy Potting Compound has a shelf-life of 12 months from the date of manufacture, as indicated by the lot number, when stored in the original, ●Component A is a mixed material of epoxy and thermal conductive powder. It is normal to cause precipitation and stratification due to different density. |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
推薦導熱封膠系列:
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| TG-A09AB Potting Compound |
| Thermal Conductivity: 2.8W/m•K |
| Viscosity @1RPM/5mins: 10~50 |
| Dielectric Breakdown Voltage: ≥11 KV/mm |
Related materials Recommended
-
●Good thermal conductivity
-
●Protect based material with high hardness for support
-
●A:B=1:1
-
●Room temperature or heating curing
TG-A09AB / TG-S09AB: is the thermally conductive sealant product newly developed by T-Global in 2022, Compared with the same type of silicone thermal conductive sealant, the thermal conductivity can reach 2.8W/m•K, it only takes 18 hours to cure the room temperature, and it only takes 30 minutes to heat and cure. After curing, it can protect electronic parts and prevent moisture and protect.